Tariqul Islam joined USTC in 2022 as a Senior Lecturer in the Faculty of Science and Engineering Technology (FSET). He has more than 9 years of research experience in the filed of semiconductor and materials science. He is also appointed as a member in the quality assurance committee.

Specialties: Semiconductor related technology development, R&D in Semiconductor fabrication technologies, CMOS, MEMS, Process integration, Photo lithography, Reactive Ion Etching, , Thin film, Physical Vapor Deposition, BEOL process integration, Reliability assessment, Cu interconnect technology.

He has conducting his PhD degree at the University of Leoben in Austria with the title, ‘Material behavior of semiconductor devices during real time operation – method development and verification’.

He has developed a novel measurement technique to investigate electrical and thermo-mechanical stress induced failure analyses and reliability assessment of semiconductor metallization thin films.

Worked as a process engineer and conducted defect analysis for the state of the art technology node test structures undergoing advanced semiconductor manufacturing process steps. Conducted wet cleaning and etching processes on Si wafers with semiconductor processing tools to investigate etch rate and particle performance to assess the process stability.

He has successfully conducted technology development projects in the micro-chip process integration area. He developed Cu-Al based self-forming diffusion barrier for modern Cu interconnect technology and dealt with thin film characterization techniques such as BTS, V-RAMP test, SEM, TEM, EDX, AES, XPS and SIMS.